Produktübersicht

Artikelnummer
HW-03-08-G-S-250-125
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch

Dokumente & Medien

Datenblätter
HW-03-08-G-S-250-125

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
3 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Series :
HW
Stack Height :
6.35 mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch

Preis & Beschaffung

Zugehöriges Produkt

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    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
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  • STMicroelectronics
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  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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