Produktübersicht

Artikelnummer
FW-05-03-G-D-125-230
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch

Dokumente & Medien

Datenblätter
FW-05-03-G-D-125-230

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
4 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
10 Position
Number of Rows :
2 Row
Packaging :
Tube
Pitch :
1.27 mm
Product :
Headers
Series :
FW-SM
Stack Height :
3.18 mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch

Preis & Beschaffung

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