Produktübersicht

Artikelnummer
DPAF-23-03.0-S-8-2-A
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors .085 X .100 DP Array Differential Pair Array Socket

Dokumente & Medien

Datenblätter
DPAF-23-03.0-S-8-2-A

Produkteigenschaften

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
2.3 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
336 Position
Number of Rows :
8 Row
Packaging :
Tray
Pitch :
2.16 mm
Product :
Sockets
Series :
DPAF
Stack Height :
10 mm
Termination Style :
Solder
Voltage Rating :
300 V

Beschreibung

Board to Board & Mezzanine Connectors .085 X .100 DP Array Differential Pair Array Socket

Preis & Beschaffung

Zugehöriges Produkt

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    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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