Produktübersicht

Artikelnummer
TW-03-12-T-D-700-310
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Dokumente & Medien

Datenblätter
TW-03-12-T-D-700-310

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Tin
Current Rating :
5.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
8 Gbps
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
6 Position
Number of Rows :
2 Row
Packaging :
Bulk
Pitch :
2 mm
Product :
Headers
Series :
TW
Stack Height :
17.78 mm
Termination Style :
Solder Pin

Beschreibung

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Preis & Beschaffung

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