Produktübersicht

Artikelnummer
HMTSW-106-23-T-S-135
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors .100 High-Temp Variable Post Height Terminal Strip

Dokumente & Medien

Datenblätter
HMTSW-106-23-T-S-135

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Tin
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
6 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Series :
HMTSW
Termination Style :
Solder Pin

Beschreibung

Board to Board & Mezzanine Connectors .100 High-Temp Variable Post Height Terminal Strip

Preis & Beschaffung

Zugehöriges Produkt

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    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
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  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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