Produktübersicht
- Artikelnummer
- 53307-1871
- Hersteller
- Molex
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors 0.8 BtB WaferAssy ST SMT 18Ckt EmbsTpPkg
Dokumente & Medien
- Datenblätter
- 53307-1871
Produkteigenschaften
- Contact Material :
- Copper
- Contact Plating :
- Tin
- Current Rating :
- 500 mA
- Housing Material :
- Thermoplastic (TP)
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 18 Position
- Number of Rows :
- 2 Row
- Packaging :
- Cut Tape, MouseReel, Reel
- Pitch :
- 0.8 mm
- Product :
- Headers
- Series :
- 53307
- Stack Height :
- 4.5 mm, 5.5 mm
- Termination Style :
- Solder
- Voltage Rating :
- 50 V
Beschreibung
Board to Board & Mezzanine Connectors 0.8 BtB WaferAssy ST SMT 18Ckt EmbsTpPkg
Preis & Beschaffung
Zugehöriges Produkt
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