Produktübersicht
- Artikelnummer
- IT5HM-100S-BGA(37)
- Hersteller
- Hirose Electric
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors
Dokumente & Medien
- Datenblätter
- IT5HM-100S-BGA(37)
Produkteigenschaften
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 200 mA
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 100 Position
- Packaging :
- Tray
- Product :
- Receptacles
- Series :
- IT5
- Termination Style :
- Solder
- Voltage Rating :
- 50 V
Beschreibung
Board to Board & Mezzanine Connectors
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
MT29F2T08EMLEEJ4-T:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08ELHBFG7-QA:B TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 FBGA QDP |
MT29F2T08EMLEEJ4-QA:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08EMLEEJ4-R:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08EMLEEJ4-QC:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08EMLEEJ4-QJ:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08EMLEEJ4-M:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F2T08ELLEEG7-QB:E TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 FBGA QDP |
MT29F4T08EUHBFM4-T:B TR | Micron | 3,000 | NAND Flash |
MT29F2T08EMLCEJ4-R:C TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F4T08GMLBEJ4:B | Micron | 3,000 | NAND Flash QLC 4T 512GX8 VBGA QDP |
MT29F2T08EMHAFJ4-3ITF:A TR | Micron | 3,000 | NAND Flash TLC 2T 256GX8 VBGA QDP |
MT29F4T08EULCEM4-T:C | Micron | 3,000 | NAND Flash TLC 4T 512GX8 LBGA 8DP |
MT29F4T08EULCEM4-QJ:C | Micron | 3,000 | NAND Flash TLC 4T 512GX8 LBGA 8DP |
MT29F4T08EQHBFG8-QA:B | Micron | 3,000 | NAND Flash TLC 4T 512GX8 FBGA 8DP |