sales@szcinty.com
Produktübersicht
- Artikelnummer
- ERF8-025-07.0-L-DV-EGP-TR
- Hersteller
- Samtec
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors 0.80 mm Edge Rate Rugged High Speed Socket
Dokumente & Medien
- Datenblätter
- ERF8-025-07.0-L-DV-EGP-TR
Produkteigenschaften
- Contact Material :
- Beryllium Copper
- Contact Plating :
- Gold
- Current Rating :
- 1.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 56 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 50 Position
- Number of Rows :
- 2 Row
- Packaging :
- Cut Tape, Reel
- Pitch :
- 0.8 mm
- Product :
- Sockets
- Series :
- ERF8
- Stack Height :
- 9 mm, 12 mm, 15 mm, 16 mm
- Termination Style :
- Solder
- Voltage Rating :
- 300 VAC
Beschreibung
Board to Board & Mezzanine Connectors 0.80 mm Edge Rate Rugged High Speed Socket
Preis & Beschaffung
Zugehöriges Produkt
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