Produktübersicht

Artikelnummer
53309-2270
Hersteller
Molex
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors 0.8 BtB WaferAssy RA SMT 22Ckt EmbsTpPkg

Dokumente & Medien

Datenblätter
53309-2270

Produkteigenschaften

Contact Material :
Copper
Contact Plating :
Tin
Current Rating :
500 mA
Housing Material :
Thermoplastic (TP)
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Right Angle
Number of Positions :
22 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, MouseReel, Reel
Pitch :
0.8 mm
Product :
Headers
Series :
53309
Stack Height :
5.65 mm, 6.65 mm
Termination Style :
Solder
Voltage Rating :
50 V

Beschreibung

Board to Board & Mezzanine Connectors 0.8 BtB WaferAssy RA SMT 22Ckt EmbsTpPkg

Preis & Beschaffung

Zugehöriges Produkt

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  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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