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CLP-103-02-F-D-TR

Produktübersicht

Artikelnummer
CLP-103-02-F-D-TR
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch

Dokumente & Medien

Datenblätter
CLP-103-02-F-D-TR

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
3.4 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
8 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
6 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, MouseReel, Reel
Pitch :
1.27 mm
Product :
Sockets
Series :
CLP
Termination Style :
Solder Pin
Voltage Rating :
280 VAC, 395 VDC

Beschreibung

Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch

Preis & Beschaffung

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