Produktübersicht

Artikelnummer
RZ150-315-115-2000
Hersteller
AirBorn
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Dokumente & Medien

Datenblätter
RZ150-315-115-2000

Produkteigenschaften

Contact Material :
Beryllium Copper
Contact Plating :
Gold
Current Rating :
500 mA
Housing Material :
Polyphenylene Sulfide (PPS)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 65 C
Mounting Angle :
Vertical
Number of Positions :
45 Position
Number of Rows :
3 Row
Pitch :
1.27 mm
Product :
Connectors
Series :
RZ
Termination Style :
Compression

Beschreibung

Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Preis & Beschaffung

Zugehöriges Produkt

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  • STMicroelectronics
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