Produktübersicht

Artikelnummer
RZ100-325-115-1000
Hersteller
AirBorn
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Dokumente & Medien

Datenblätter
RZ100-325-115-1000

Produkteigenschaften

Contact Material :
Beryllium Copper
Contact Plating :
Gold
Current Rating :
500 mA
Housing Material :
Polyphenylene Sulfide (PPS)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 65 C
Mounting Angle :
Vertical
Number of Positions :
75 Position
Number of Rows :
3 Row
Pitch :
1.27 mm
Product :
Connectors
Series :
RZ
Termination Style :
Compression

Beschreibung

Board to Board & Mezzanine Connectors Low Profile High-Density One Piece Interposer Compression Connector

Preis & Beschaffung

Zugehöriges Produkt

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  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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