产品概览

产品型号
909-37.5-2-18-2-B-0
制造商
Wakefield-Vette
产品类别
散热片
产品描述
Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 17.6mm Height, Aluminum, Black Anodized

文档与媒体

数据列表
909-37.5-2-18-2-B-0

产品详情

Designed for :
37 mm Components
Fin Style :
Omnidirectional Fin
Heatsink Material :
Aluminum
Mounting Style :
Clip
Product :
Heat Sinks

产品描述

Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 17.6mm Height, Aluminum, Black Anodized

采购与价格

推荐产品

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号 品牌 库存 描述
6084BG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level, Stamped Heat Sink for TO-220, TO-220-Single Gauge, Vertical Mounting, 8.38x13.21x19.05mm
575002T00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Channel Style, Stamped Heat Sink with Two Integrated Tabs for TO-220, Vertical Mounting, 13.6 n Thermal Resistance, Black Paint, 3.10mm Hole
Y92B-S08N Omron Industrial Automation 3,000 Heat Sinks G3S HEAT SINK
RHS300 Carlo Gavazzi 3,000 Heat Sinks SSR 1PH/3PH DIN RAIL HEAT SINK
374224B60023G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks BGA Solder Anchor, 23x23x25mm, Black Anodized, 2 Anchors, IC Pkg Size = 23 x 23
574602B03300G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Slide-On Style Stamped Heat Sink for TO-220, Low-Cost, Labor Saving, Spring Action, Vertical Mounting, 21.6 n Thermal Resistance, 1.91mm Hole, 17.53mm, Solderable Tabs
508700B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Extruded Style Heat Sink with Epoxy Attach-On for DIPS, Straight Fins, Horizontal Mounting, 27.2 n Thermal Resistance, Black Anodized, 50.8mm
1542706-3 TE Connectivity / AMP Connectors 3,000 Heat Sinks XFP. MSA NETWORK APPLICATION H
1963856-1 TE Connectivity / AMP Connectors 3,000 Heat Sinks CFP HEAT SINK 10.27MM PASSIVE
322805B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level, Extruded Heat Sink for TO-5, Vertical Mounting, 22.23x22.23x13.49mm
RHS45BD Carlo Gavazzi 3,000 Heat Sinks SSR 1PH DIN-RAIL HEATSINK ASSY
364424B00032G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black Anodized, 40.1x40x11.4mm, IC Pkg Size = 40 x 40, Tape #32
1542656-4 TE Connectivity 3,000 Heat Sinks XFP.MSA PCI APPLICATION HEATSI
326005R00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level Heat Sink for TO-5, Vertical Mounting, 12.7x12.7x9.52mm
6224BG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Square Basket Style, Board Level, Stamped Heat Sink for Bridge Rectifier, Vertical Mounting, 9.4 n Thermal Resistance, 4.77mm