RQ73C2B14K7BTD - TE Connectivity / Holsworthy - HKCINTY

RQ73C2B14K7BTD

产品概览

产品型号: RQ73C2B14K7BTD

制造商: TE Connectivity / Holsworthy

产品类别: 薄膜电阻器

产品描述: Thin Film Resistors - SMD RQ 1206 14K7 0.1% 10PPM 5K RL

文档与媒体

数据列表: RQ73C2B14K7BTD

产品详情

Case Code - in :: 1206

Case Code - mm :: 3216

Maximum Operating Temperature :: + 155 C

Minimum Operating Temperature :: - 55 C

Packaging :: Reel

Power Rating :: 400 mW

Qualification :: AEC-Q200

Resistance :: 14.7 kOhms

Series :: RQ73

Temperature Coefficient :: 10 PPM / C

Tolerance :: 0.1 %

Voltage Rating :: 200 V

产品描述

Thin Film Resistors - SMD RQ 1206 14K7 0.1% 10PPM 5K RL

采购与价格

推荐产品

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号	品牌	库存	描述
SP1200-0.012-00-137	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.012 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200
SPA2000-0.020-00-44	Bergquist Company	3,000	Thermal Interface Products High Reliability Insulator, 0.020 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
PPK4-0.006-00-23	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4
HF625-0.005-AC-129	Bergquist Company	3,000	Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625
SP2000-0.010-00-50	Bergquist Company	3,000	Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000
SP900S-0.009-00-98	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
SP980-0.009-00-125	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
HF625-0.005-AC-128	Bergquist Company	3,000	Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625
PP1000-0.009-00-70	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000
SP980-0.009-00-17	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
SP2000-0.010-00-60	Bergquist Company	3,000	Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000
SP900S-0.009-00-135	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
SP980-0.009-00-92	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
BP100-0.011-00-44	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
PPK10-0.006-00-103	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10