CRGH1206F12K7 - TE Connectivity / Holsworthy - HKCINTY

CRGH1206F12K7

产品概览

产品型号: CRGH1206F12K7

制造商: TE Connectivity / Holsworthy

产品类别: 厚膜电阻器

产品描述: Thick Film Resistors - SMD CRGH1206 1% 12K7 0.5W

文档与媒体

数据列表: CRGH1206F12K7

产品详情

Case Code - in :: 1206

Case Code - mm :: 3216

Features :: -

Maximum Operating Temperature :: + 125 C

Minimum Operating Temperature :: - 55 C

Packaging :: Reel

Power Rating :: 500 mW (1/2 W)

Resistance :: 12.7 kOhms

Series :: CRGH

Tolerance :: 1 %

Voltage Rating :: 200 V

产品描述

Thick Film Resistors - SMD CRGH1206 1% 12K7 0.5W

采购与价格

推荐产品

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号	品牌	库存	描述
BP100-0.008-00-120	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP900S-0.009-AC-39	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S
PPK4-0.006-00-114	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4
HF300P-0.001-00-137	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SPK4-0.006-00-42	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4
PP400-0.009-00-3	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
PP400-0.009-00-128	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
Q3-0.005-AC-38	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3
PP400-0.009-00-86	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
PPK4-0.006-00-42	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4
HF650P-0.0015-01-134	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
PP1000-0.009-00-23	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000
SPK4-0.006-00-114	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4
SPK4-0.006-AC-134	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
HF300P-0.001-00-138	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P