MA4SW410 - MACOM - HKCINTY

MA4SW410

产品概览

产品型号: MA4SW410

制造商: MACOM

产品类别: 射频开关 IC

产品描述: RF Switch ICs 50MHz-26GHz IL .9dB @20GHz

文档与媒体

数据列表: MA4SW410

产品详情

Insertion Loss :: 0.9 dB

Maximum Frequency :: 20 GHz

Maximum Operating Temperature :: + 125 C

Minimum Frequency :: 50 MHz

Minimum Operating Temperature :: - 65 C

Mounting Style :: SMD/SMT

Off Isolation - Typ :: 34 dB

Package / Case :: HMIC Die

Packaging :: Tray

Switch Configuration :: SP4T

Technology :: SI

产品描述

RF Switch ICs 50MHz-26GHz IL .9dB @20GHz

采购与价格

推荐产品

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号	品牌	库存	描述
SP900S-0.009-00-87	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
PP1000-0.009-AC-28	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000
SPK6-0.006-00-10	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
BP100-0.005-00-138	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
BP100-0.008-00-96	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SPA2000-0.020-00-43	Bergquist Company	3,000	Thermal Interface Products High Reliability Insulator, 0.020 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
SPK6-0.006-AC-56	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
Q3-0.005-AC-99	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3
PPK10-0.006-AC-98	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK1300/Poly-Pad K-10
HF650P-0.002-01-86	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
BP100-0.005-00-47	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
PPK10-0.006-AC-135	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK1300/Poly-Pad K-10
SPK6-0.006-00-53	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
SP900S-0.009-00-125	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
HF300P-0.0015-00-8	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P