产品概览

产品型号
C317C390F3G5TA7301
制造商
KEMET Electronics
产品类别
多层陶瓷电容器 MLCC - 引线
产品描述
Multilayer Ceramic Capacitors MLCC - Leaded 25V 39pF C0G 1% LS=5.08mm

文档与媒体

数据列表
C317C390F3G5TA7301

产品详情

Capacitance :
39 pF
Dielectric :
C0G (NP0)
Lead Spacing :
5.08 mm
Termination Style :
Radial
Tolerance :
1 %
Voltage Rating DC :
25 VDC

产品描述

Multilayer Ceramic Capacitors MLCC - Leaded 25V 39pF C0G 1% LS=5.08mm

采购与价格

推荐产品

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号 品牌 库存 描述
SPA1500-0.010-AC-58 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A2000/Sil-Pad A1500
SPK6-0.006-AC-37 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
PP1000-0.009-AC-104 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000
SP2000-0.010-AC-54 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 3500/Sil-Pad 2000
GF3500S35-00-60-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 3600/Gap Filler 3500S35
LBSA1000-00-00-600CC Bergquist Company 3,000 Thermal Interface Products Liquid Adhesive, 600CC Cartridge, Liqui-Bond TLB SA1000/Liqui-Bond SA 1000
SPK10-0.006-AC-8.2/50 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 8.2x50' Roll, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10
TLBSA2005RT-00-00-400cc Bergquist Company 3,000 Thermal Interface Products Thermal Adhesive, 2Part, 400cc Kit, Liqui-Bond TLB SA2005RT/Liqui-Bond SA 2005RT
TLBSA2005RT-00-030-400cc Bergquist Company 3,000 Thermal Interface Products Thermal Adhesive, 2Part, 400cc Kit, Liqui-Bond TLB SA2005RT/Liqui-Bond SA 2005RT
TIC4000-00-00-25CC Bergquist Company 3,000 Thermal Interface Products TI Compound, 25CC Syringe, TI Compound TGR 4000/TI Compound 4000
2594744 Bergquist Company 3,000 Thermal Interface Products Laminate Material, Bond-Ply TBP 1400LMS-HD/Bond-Ply LMS-HD
LBSA2000-00-00-600CC Bergquist Company 3,000 Thermal Interface Products Liquid Adhesive, 600CC Cartridge, Liqui-Bond TLB SA2000/Liqui-Bond SA 2000
GF3500LV-00-240-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 3500LVO/Gap Filler 3500LV
GF3500S35-07-60-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 3600/Gap Filler 3500S35
LBSA1000-07-00-600CC Bergquist Company 3,000 Thermal Interface Products Liquid Adhesive, 600CC Cartridge, Liqui-Bond TLB SA1000/Liqui-Bond SA 1000