rfq@cintymcu.com
产品概览
- 产品型号
- REC5-4815DRWZ/H4/A/SMD-R
- 制造商
- RECOM Power
- 产品类别
- 隔离式 DC/DC 转换器
- 产品描述
- Isolated DC/DC Converters 5W DC/DC 4kV REG 4:1 18-72Vin +/-15Vout
文档与媒体
产品详情
- Height :
- 10.16 mm
- Industry :
- Industrial
- Input Voltage, Max :
- 72 V
- Input Voltage, Min :
- 18 V
- Input Voltage, Nominal :
- 48 V
- Isolation Voltage :
- 4 kV
- Length :
- 32 mm
- Mounting Style :
- SMD/SMT
- Number of Outputs :
- 2 Output
- Output Current-Channel 1 :
- 170 mA
- Output Current-Channel 2 :
- 170 mA
- Output Power :
- 5 W
- Output Voltage-Channel 1 :
- 15 V
- Output Voltage-Channel 2 :
- - 15 V
- Package / Case :
- SMD-24
- Product :
- Isolated
- Series :
- REC5-S_DRW(Z)
- Width :
- 20.3 mm
产品描述
Isolated DC/DC Converters 5W DC/DC 4kV REG 4:1 18-72Vin +/-15Vout
采购与价格
推荐产品
您可能在找
| 型号 | 品牌 | 库存 | 描述 |
|---|---|---|---|
| conga-TCA3/CSP-T-HF | congatec | 3,000 | Heat Sinks Standard passive cooling solution for COM Express module conga-TCA3 with 10mm fins. All standoffs are M2.5mm thread. |
| conga-TCA3/CSP-B-HF | congatec | 3,000 | Heat Sinks Standard passive cooling solution for COM Express module conga-TCA3 with 10mm fins. All standoffs are 2.7mm bore hole. |
| HTS-cAL-BT-I | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-AL (APL-I) with through hole standoffs for top mounting |
| HTS-cWL-B | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-WL with threaded standoffs for bottom mounting |
| THS-nXAL-BT | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for nanoX-AL (APL) with through hole standoffs for top mounting |
| THS-cAL-BT | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for cExpress-AL (APL) with through hole standoffs for top mounting |
| THS-nXAL-B | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for nanoX-AL (APL) with threaded standoffs for bottom mounting |
| conga-TCA3/CSP-T | congatec | 3,000 | Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| conga-TCA5/CSP-T | congatec | 3,000 | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. |
| conga-TCA5/CSP-B | congatec | 3,000 | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. |
| HTS-cBT-B | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-BT/BT2 |
| THS-cAL-BT-I | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for cExpress-AL (APL-I) with through hole standoffs for top mounting |
| THS-cAL-B-I | ADLINK Technology | 3,000 | Heat Sinks Low profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting |
| 7128Q310000E | Axiomtek | 3,000 | Heat Sinks Q7M310 Heat Spreader |
| 5078D881300E | Axiomtek | 3,000 | Heat Sinks Broadwell (BDW) Heatspreader for CEM881 |
