MTMM-110-14-T-D-590 - Samtec - HKCINTY

MTMM-110-14-T-D-590

产品概览

产品型号: MTMM-110-14-T-D-590

制造商: Samtec

产品类别: 集管和线壳

产品描述: Headers & Wire Housings Variable Post Height Header Strips, 2.00 mm Pitch

文档与媒体

数据列表: MTMM-110-14-T-D-590

产品详情

Contact Gender :: Pin (Male)

Maximum Operating Temperature :: + 105 C

Minimum Operating Temperature :: - 55 C

Mounting Angle :: Straight

Mounting Style :: Through Hole

Number of Positions :: 20 Position

Number of Rows :: 2 Row

Packaging :: Bulk

Pitch :: 2 mm

Product :: Headers

Row Spacing :: 2 mm

Series :: MTMM

Termination Style :: Solder Pin

Type :: Pin Strip

产品描述

Headers & Wire Housings Variable Post Height Header Strips, 2.00 mm Pitch

采购与价格

推荐产品

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号	品牌	库存	描述
SPK4-0.006-AC-94	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
SP900S-0.009-AC-31	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S
PP1000-0.009-00-30	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000
BP100-0.008-00-84	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
HF625-0.005-00-32	Bergquist Company	3,000	Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
BP100-0.008-00-11	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP400-0.007-AC-39	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SP1500ST-0.008-02-66	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST
SP800-0.005-AC-39	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800
HF650P-0.002-01-35	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
BP100-0.005-00-68	Bergquist Company	3,000	Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SPK4-0.006-AC-56	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4
HF650P-0.001-01-42	Bergquist Company	3,000	Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
PP400-0.009-00-136	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
SP800-0.005-00-94	Bergquist Company	3,000	Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800