产品概览

产品型号
XTEAWT-00-0000-00000BDE8
制造商
Cree LED
产品类别
大功率 LED - 白色
产品描述
High Power LEDs - White White, 107lm

文档与媒体

产品详情

Color Rendering Index - CRI :
70
Height :
2.36 mm
If - Forward Current :
350 mA
Illumination Color :
Warm White
Length :
3.45 mm
Lens Dimensions :
3.06 mm
Lens Shape :
Dome
Lens Transparency :
Water Clear
Luminous Flux/Radiant Flux :
107 lm
Luminous Intensity :
-
Maximum Operating Temperature :
+ 85 C
Mounting Style :
SMD/SMT
Package / Case :
SMD-2
Packaging :
Cut Tape, MouseReel, Reel
Power Rating :
5 W
Product :
White LEDs
Series :
XTEAWT
Vf - Forward Voltage :
2.85 V
Viewing Angle :
115 deg
Wavelength/Color Temperature :
2700 K
Width :
3.45 mm

产品描述

High Power LEDs - White White, 107lm

采购与价格

推荐产品

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

您可能在找

型号 品牌 库存 描述
MT29C2G24MAAAAKAMD-5 IT TR Micron 3,000 Multichip Packages MASSFLASH/MOBILE DDR 3G
W25M512JVBIM TR Winbond 3,000 Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR
W25M512JVCIQ TR Winbond 3,000 Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
W25M512JVBIQ TR Winbond 3,000 Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
W25M512JVCIM TR Winbond 3,000 Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR
MT29C2G24MAAAAKAKD-5 IT Micron 3,000 Multichip Packages MASSFLASH/MOBILE DDR 3G
W25M512JWBIQ TR Winbond 3,000 Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
W25M512JWBIM TR Winbond 3,000 Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
W25M512JWCIQ TR Winbond 3,000 Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
W25M512JWCIM TR Winbond 3,000 Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR
W71NW10GE3FW Winbond 3,000 Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
W71NW11GBADW Winbond 3,000 Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16
W25M161AVEIT TR Winbond 3,000 Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
MT29GZ5A3BPGGA-046IT.87K Micron 3,000 Multichip Packages NAND MCP 6G
MT29C4G48MAYBBAKS-48 IT TR Micron 3,000 Multichip Packages MASSFLASH/MOBILE DDR 6G