文档与媒体
- 数据列表
- HW-09-09-F-S-500-115
产品详情
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 9 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HW
- Stack Height :
- 12.7 mm
- Termination Style :
- Solder
产品描述
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
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