文档与媒体
产品详情
- Contact Material :
- Beryllium Copper
- Contact Plating :
- Gold
- Current Rating :
- 2.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 28 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 104 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 0.8 mm
- Product :
- Sockets
- Series :
- QRF8
- Stack Height :
- 7 mm, 10 mm, 12 mm
- Termination Style :
- Solder Pin
- Voltage Rating :
- 215 VAC
产品描述
Board to Board & Mezzanine Connectors 0.80 mm Q Rate Slim Body Ground Plane Socket
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